[eepro100] bonded eepro100 interfaces and interface aliasing
Rob Latham
rlatham@plogic.com
Tue, 19 Jun 2001 00:02:07 -0400
let's say i had a cluster with the following:
. 4 nodes with two eepro100 interfaces,
. 1 network-addressable power switch
. 1 addressable switch.
If i channel bond the interfaces, i'll get the improved bandwidth,
sure. But now accesses to the "accessories" ( power switch, network
switch) will be very very erratic. With only one NIC on the
accessories, they have to be on one half of the split switch or the
other, and they won't see half the packets sent to them.
sure, packets will *eventually* get through, thanks to tcp's efforts
to be reliable, but it's nice to be able to use the web interfaces to
the switch for example without lengthy delays.
my first thought was to alias an interface and use that to talk to the
non-bonded entities on the network. The scheme was to do something
like
bond0, eth0, eth1: 192.168.1.0/255.255.255.0
eth0:0 : 192.168.2.0/255.255.255.0
my theory was that if the power and network switches were on the same
partition of the switch as the eth0 nic, linux would send packets to
those devices over the correct card and everything would be happy.
shows what i know :>. it looks to me like the bonding tricks hold on
pretty tight to the slave interfaces and won't let me trick it into
sending trafic over just one nic when i want to.
I freely admit not knowing enough about how the eepro100 driver
interacts with the bonding module: any assistance would be
appreciated
thanks
==rob
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[ Rob Latham <rlatham@plogic.com> Developer, Admin, Alchemist ]
[ Paralogic Inc. - www.plogic.com ]
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--
[ Rob Latham <rlatham@plogic.com> Developer, Admin, Alchemist ]
[ Paralogic Inc. - www.plogic.com ]
[ ]
[ EAE8 DE90 85BB 526F 3181 1FCF 51C4 B6CB 08CC 0897 ]